The project will have three main technical goals. The outreach aspects of the project involve training undergraduate and graduate students for the electronic design automation industry. Researchers will bring together techniques from chip design, thermal and reliability analysis, mechanical simulation and other domains learning each other?s fields of expertise, and creating new analysis tools that will be used in both industry and teaching contexts. This project will develop the "multiphysics" analysis methods that aims to address such questions for future electronic system designers. The analysis must also span time scales from nanoseconds to years, and spatial scales from nanometers to centimeters. To guarantee this, engineers need analysis tools that understand mechanical shock, temperature, aging and in addition to electrical phenomena - in short, many different "physics" that are all wrapped up into a single analysis question. Primary Place of Performance Congressional District:Ġ40100 NSF RESEARCH & RELATED ACTIVIT 040100 NSF RESEARCH & RELATED ACTIVITĭesign tools and methods for electronic components need to ensure that they are low-cost, low-energy, last longer, deliver better performance, and operate correctly across a diverse range of conditions. Chung-Kuan Cheng (Co-Principal Investigator).Andrew Kahng (Principal Investigator) Jiun-Shyan Chen (Co-Principal Investigator).Sankar Basu (703)292-7843 CCF Division of Computing and Communication Foundations CSE Direct For Computer & Info Scie & EnginrįY 2016 = $900,000.00 FY 2017 = $16,000.00
SHF: Medium: Closing Multiphysics Analysis Gaps in System Design NSF Org:ĬCF Division of Computing and Communication Foundations
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